Title:
ACIDIC COPPER PLATING LIQUID, ACIDIC COPPER PLATED ARTICLE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018165375
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an acidic copper plating liquid capable of controlling the heat expansion of a plated article, an acidic copper plated article obtained by using the plating liquid, and a method of producing a semiconductor device using the plating liquid.SOLUTION: The acidic copper plating liquid according to the present invention comprises a first additive comprised of a cationic polymer, at least one kind of a second additive selected from the group consisting of 2-mercapto-5-benzimidazole sulfonic acid, dihydrate sodium 2-mercapto-5-benzimidazole sulfonate, ethylene thiourea, and a partial 2-mercapto-5-benzimidazole sulfonic acid salt of poly(diallyldimethyl ammonium chloride), and a third additive comprised of an organic compound comprising a sulfur atom, with the copper concentration therein being 10 to 60 g/L, the sulfuric acid concentration therein being 10 to 200 g/L, and a chloride ion contained therein in an amount of 90 mg/L or less. The acidic copper plating liquid can produce an acidic copper plated article of low thermal expansion.SELECTED DRAWING: Figure 5
Inventors:
KONDO KAZUO
Application Number:
JP2016229501A
Publication Date:
October 25, 2018
Filing Date:
November 25, 2016
Export Citation:
Assignee:
KONDO KAZUO
International Classes:
C25D3/38; C25D5/02; C25D7/12; H01L21/28; H01L21/288
Attorney, Agent or Firm:
Samejima Mutsumi
Keiichi
Keiichi