Title:
CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE USING THEM
Document Type and Number:
Japanese Patent JP2018168215
Kind Code:
A
Abstract:
To provide an addition curable type curable silicone resin composition providing a cured product excellent in transparency and a cured product, and a semiconductor device using them.SOLUTION: There are provided a curable silicone resin composition which contains at least component (A): a silicone resin having a hydrogen atom bonded to a silicon atom represented by formula (1), a vinyl group bonded to a silicon atom and a methyl group bonded to a silicon atom at specific ratios, and component (B): a hydrosilylation catalyst, a method for producing the silicone resin, an adhesive for optical semiconductor formed from a cured product of the curable silicone resin composition, and an optical semiconductor device using the adhesive for optical semiconductor.SELECTED DRAWING: Figure 1
Inventors:
AKIYAMA KATSUHIRO
KAWAI WATARU
OGAWA TAKESHI
SEKIYA YUKI
KAWAI WATARU
OGAWA TAKESHI
SEKIYA YUKI
Application Number:
JP2017064626A
Publication Date:
November 01, 2018
Filing Date:
March 29, 2017
Export Citation:
Assignee:
CENTRAL GLASS CO LTD
International Classes:
C08L83/05; C08G77/20; C08L83/07; H01L23/29; H01L23/31; H01L31/02; H01L33/56
Attorney, Agent or Firm:
Kiyoshi Yangi