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Patent Searching and Data


Title:
FILM FORMING APPARATUS
Document Type and Number:
Japanese Patent JP2018171898
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a film forming apparatus capable of further enhancing uniformity of a film thickness.SOLUTION: There is provided a film forming apparatus that comprises a die for extruding a molten resin into a tube shape from an annular discharging port 18a, and a film thickness adjusting unit 2 for adjusting a thickness of the molten resin extruded from the discharging port 18a. The die includes an outer peripheral member 14 that defines an outer periphery of the discharging port 18a. The film thickness adjusting unit 2 that is arranged around the outer peripheral member 14, and comprises a plurality of adjusting units 16 for adjusting a width of the discharging port 18a in a radial direction, a cooling device 3 that is disposed above the outer peripheral member 14 and the plurality of adjusting units 16, and blows cooling air to the molten resin extruded from the discharging port 18a, and a blocking member 66 for suppressing inflow of air from a space between the cooling device 3 and the outer peripheral member 14 to the molten resin.SELECTED DRAWING: Figure 9

Inventors:
NAKANO KATSUYUKI
SHIOTA TAKAHIRO
Application Number:
JP2018038913A
Publication Date:
November 08, 2018
Filing Date:
March 05, 2018
Export Citation:
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Assignee:
SUMITOMO HEAVY IND MODERN LTD
International Classes:
B29C48/325; B29C48/92
Domestic Patent References:
JPH09225995A1997-09-02
JP5634630B12014-12-03
JPH06305020A1994-11-01
JPS6042618U1985-03-26
JP3008206U1995-03-07
Foreign References:
US6783344B12004-08-31
Attorney, Agent or Firm:
Sakaki Morishita
Tomisho Teruo