Title:
PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018173471
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that ensures heat resistance and patterning properties while achieving adhesiveness to a semiconductor element, and provide a laminated semiconductor device prepared with a cured product of the photosensitive resin composition.SOLUTION: A photosensitive resin composition contains (A) alkali-soluble resin, (B) photoacid generator, (C) heat crosslinker, and (D) thermoplastic resin, where the (D) thermoplastic resin is a modified product of a compound that can be extracted from plants, and has a phenolic hydroxyl group in the molecule. Use of the photosensitive resin composition makes it possible to achieve all of heat resistance, patterning properties and adhesiveness.SELECTED DRAWING: Figure 1
Inventors:
KIKUCHI SEIYA
Application Number:
JP2017070214A
Publication Date:
November 08, 2018
Filing Date:
March 31, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/004; C08G59/02; G03F7/023