Title:
LASER PROCESSING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JP2018181938
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent subsequent laser beam radiation from being disturbed by debris or the like that is generated by preceding laser beam radiation.SOLUTION: A laser processing device comprises a laser beam radiation unit configured to radiate multiple laser beams that are oscillated by a laser beam oscillator, branched and formed by a laser beam branch unit, through a condenser lens to a wafer that is held on a chuck table. The present invention relates to a laser processing method for a wafer for processing the wafer which is partitioned by multiple predetermined dividing lines that are set in a lattice shape on a surface. The laser processing method includes a processing groove forming step of radiating the multiple laser beams to the wafer along the predetermined dividing lines and forming a processing groove along the predetermined dividing lines on the wafer. In the processing groove forming step, the multiple laser beams that are branched by the laser beam branch unit are disposed in a columnar shape in a non-parallel direction with respect to an extension direction of the predetermined dividing lines to which the multiple laser beams are radiated.SELECTED DRAWING: Figure 3
Inventors:
BAN YURI
Application Number:
JP2017075405A
Publication Date:
November 15, 2018
Filing Date:
April 05, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/064; B23K26/364; B23K26/38
Domestic Patent References:
| JP2016021567A | 2016-02-04 | |||
| JP2004268144A | 2004-09-30 | |||
| JP2013173160A | 2013-09-05 | |||
| JP2014223677A | 2014-12-04 | |||
| JP2011067873A | 2011-04-07 | |||
| JP2016203222A | 2016-12-08 | |||
| JPH08243766A | 1996-09-24 | |||
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| JP2016208035A | 2016-12-08 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Tomohiro Okamoto
Kasahara Takahiro