Title:
MOLD APPARATUS AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2018187798
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mold apparatus capable of reducing interference between a piece and a mold with a simple configuration and a molding method for a resin molded article using the mold apparatus.SOLUTION: A mold apparatus provided with a mold 1a and a piece 2 is configured such that a gap between the mold 1a and the piece 2 changes in accordance with a relative displacement of the mold 1a and the piece 2. Since an upper surface 13au of a pinch-off part 13a and a tip bottom surface 21t1 of the piece 2 are not in contact with each other when the piece 2 is relatively displaced, interference between these surfaces can be reduced, and furthermore, since an inner bottom surface 11at of the mold 1a and a lower side surface 21sb of the piece 2 are not in contact with each other, interference between these surfaces can be reduced.SELECTED DRAWING: Figure 10
Inventors:
IGARASHI YU
Application Number:
JP2017090037A
Publication Date:
November 29, 2018
Filing Date:
April 28, 2017
Export Citation:
Assignee:
KYORAKU CO LTD
International Classes:
B29C51/30; B29C51/02; B29C51/32
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito