Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
Japanese Patent JP2018188708
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-yielding plating apparatus and a plating method.SOLUTION: A plating apparatus 1 comprises: at least one plating treatment unit 5 for applying a plating treatment to a wafer 100; a measuring unit 7 for measuring a pre-treatment weight Wof the wafer 100 before the plating treatment is applied and a post-treatment weight Wof the wafer 100 after the plating treatment is applied; and a control unit 9 (a determination unit) for determining whether or not a plating layer weight ΔW is within a range (a threshold αor more and a threshold αor less) of a predetermined threshold, regarding the difference between the pre-treatment weight Wand the post-treatment weight Was the plating layer weight (a plating unit weight) ΔW of a plating layer 102 adhered to the wafer 100 by the plating treatment.SELECTED DRAWING: Figure 2
Inventors:
ITO ATSUYUKI
Application Number:
JP2017093821A
Publication Date:
November 29, 2018
Filing Date:
May 10, 2017
Export Citation:
Assignee:
SAN AI ENG CO LTD
International Classes:
C25D21/12; C25D7/12; C25D17/06; C25D19/00; G01G17/04; H01L21/288
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi