Title:
HEAT STORAGE BOARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2018189296
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a heat storage board capable of easily manufacturing a heat storage board containing a predetermined amount of latent heat storage material at a predetermined portion.SOLUTION: A manufacturing method of a heat storage board 1 comprises at least: a step of integrating wood pieces 2 with adhesive mixed thereto, to form a forming mat 1a; and a step of subjecting the forming mat 1a to heat press molding, to mold a wood board 1A with the wood pieces 2 bonded through the adhesive. Here, in the step of forming the forming mat 1a, heat storage particles 3 are arranged in the forming mat 1a so that the heat storage particles 3 are dispersed, the heat storage particle comprising a mixture containing thermoplastic resin and latent heat storage material, and in the step of molding the wood board 1A, the forming mat 1a where the heat storage particles 3 are dispersed, is subjected to heat press molding at a temperature higher than a softening point of the thermoplastic resin, thereby manufacturing the heat storage board 1.SELECTED DRAWING: Figure 1
Inventors:
HARADA KAZUNOBU
INOUE TAKAO
INOUE TAKAO
Application Number:
JP2017091602A
Publication Date:
November 29, 2018
Filing Date:
May 02, 2017
Export Citation:
Assignee:
EIDAI CO LTD
International Classes:
F28D20/02; B27N3/00; B32B7/02; B32B21/13; C09K5/06; E04B1/76
Domestic Patent References:
| JP2003260705A | 2003-09-16 | |||
| JP2012518563A | 2012-08-16 | |||
| JP2007119656A | 2007-05-17 | |||
| JP2014140981A | 2014-08-07 | |||
| JP2014180812A | 2014-09-29 | |||
| JP2016124949A | 2016-07-11 | |||
| JP2006240086A | 2006-09-14 |
Foreign References:
| WO2015174523A1 | 2015-11-19 |
Attorney, Agent or Firm:
Hiraki International Patent Office