Title:
LAMINATE AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2018195741
Kind Code:
A
Abstract:
To provide: a laminate which has a support body superior in mechanical property, and which can suppress the deformation of a polymer film after delamination of the support body; and a method for manufacturing a flexible electronic device using the laminate.SOLUTION: A laminate is to be used for manufacturing a flexible electronic device. The laminate comprises: a polymer film having a glass dislocation temperature in a range of 50-200°C. which is determined by differential scanning calorimetry (DSC); and a support body including a metal or a metal compound, and temporality fixed by the polymer film. An absolute value of the difference in temperature expansion efficient between the support body and the polymer film in a temperature region A ranging from 30 to 120°C of the polymer film in a longitudinal direction, and an absolute value of the difference in temperature expansion efficient between the support body and the polymer film at the temperature region A in a widthwise direction are each 5 ppm/°C or under. The laminate can be used for manufacturing a flexible electronic device.SELECTED DRAWING: None
Inventors:
KURAGAKI MASAHIRO
WATANABE NAOKI
WATANABE NAOKI
Application Number:
JP2017099365A
Publication Date:
December 06, 2018
Filing Date:
May 18, 2017
Export Citation:
Assignee:
TEIJIN LTD
TOYO BOSEKI
TOYO BOSEKI
International Classes:
H01L21/336; B32B15/08; B32B15/09; H01L29/786; H05K1/03
Domestic Patent References:
| JP2015198176A | 2015-11-09 | |||
| JP2014237270A | 2014-12-18 | |||
| JP2015193101A | 2015-11-05 |
Foreign References:
| WO2009037797A1 | 2009-03-26 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda