Title:
HEAT-SENSITIVE RESPONSIVE POLYMER COMPOUND, AND SUSTAINED RELEASE BIODEGRADABLE BIOMEDICAL MATERIAL USING COMPOUND
Document Type and Number:
Japanese Patent JP2018199747
Kind Code:
A
Abstract:
To provide a heat-sensitive responsive polymer that does not induce degradation of heat-sensitive responsiveness even when a structure of the heat-sensitive responsive polymer is modified to control a phase transition temperature.SOLUTION: A heat-sensitive responsive polymer compound according to the present invention is obtained by introducing an oligoethylene glycol chain in at least a part of N-sites of monomer units constituting an N-vinyl amide-based polymer or an N-vinyl amide-based copolymer and is specifically represented by the following general formula (1). (Chemical Formula 1)SELECTED DRAWING: None
Inventors:
AJIRO KOJI
KAWATANI RYO
KAWATANI RYO
Application Number:
JP2017103673A
Publication Date:
December 20, 2018
Filing Date:
May 25, 2017
Export Citation:
Assignee:
NARA INSTITUTE OF SCHIENCE AND TECH
International Classes:
C08F126/02; A61K47/32; A61L31/04; A61L31/14
Attorney, Agent or Firm:
Kyoto International Patent Office