Title:
CURABLE RESIN COMPOSITION FOR FORMING FLEXIBLE RESIN AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2018203827
Kind Code:
A
Abstract:
To provide a curable resin composition that can form a flexible resin layer having excellent flexibility and elasticity, low tack, and excellent handleability.SOLUTION: A curable resin composition for forming a flexible resin contains (A) styrenic elastomer, (B) polymerizable monomer and (C) polymerization initiator. The polymerizable monomer contains a silicone compound having a (meth) acryloyloxy group.SELECTED DRAWING: None
Inventors:
SHIBATA TOMOAKI
OTAKE SHUNSUKE
UEHARA SATOSHI
TENDO KAZUYOSHI
MINEGISHI TOMONORI
OTAKE SHUNSUKE
UEHARA SATOSHI
TENDO KAZUYOSHI
MINEGISHI TOMONORI
Application Number:
JP2017108051A
Publication Date:
December 27, 2018
Filing Date:
May 31, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F290/06; C08F287/00; H05K3/28
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita