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Title:
METHOD OF PRODUCING HIGH-PURITY ELECTROLYTIC COPPER
Document Type and Number:
Japanese Patent JP2018204102
Kind Code:
A
Abstract:
To provide a method of producing high-purity electrolytic copper that has small orientation difference of crystal grains and has far much less total-impurity concentration such as Ag and S.SOLUTION: A method of producing electrolytic copper of this invention includes: a step of adding to copper electrolyte a first additive agent (A) containing a hydrophobic aromatic ring and a hydrophilic polyoxyalkylene group, a second additive agent (B) composed of a polyvinyl alcohol group, and a third additive agent (C) composed of tetrazole group; and a step of processing copper electrolysis by controlling each of concentrations of the first additive agent (A), the second additive agent (B), and the third additive agent (C), a current density, and a bath temperature to obtain the electrolytic copper that has an Ag concentration of less than 0.2 mass ppm, an S concentration of less than 0.07 mass ppm, and a total-impunity concentration of less than 0.2 mass ppm and in which average orientation difference in crystal grains (referred as a GOS value) is such that crystal grains exceeding 2.5° are contained 10% or less in an area ratio.SELECTED DRAWING: None

Inventors:
TARUTANI YOSHIE
KUBOTA KENJI
NAKAYA KIYOTAKA
ARAI AKIRA
Application Number:
JP2018097318A
Publication Date:
December 27, 2018
Filing Date:
May 21, 2018
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C25C1/12; C25C7/06
Domestic Patent References:
JPH02185990A1990-07-20
JP2001123289A2001-05-08
JP2017043834A2017-03-02
Foreign References:
US20170088963A12017-03-30
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami