Title:
Cu-Ni-Al-BASED COPPER ALLOY SHEET MATERIAL, MANUFACTURING METHOD THEREOF, AND CONDUCTIVE SPRING MEMBER
Document Type and Number:
Japanese Patent JP2019002042
Kind Code:
A
Abstract:
To provide a high strength Cu-Ni-Al-based copper alloy sheet material excellent in surface smoothness of an etching processed surface.SOLUTION: There is provided a copper alloy sheet material having a chemical composition consisting of, by mass%, Ni:10.0 to 30.0%, Al:7.50% or less and Ni/Al≤15.00, Mg:0 to 0.30%, Cr:0 to 0.20%, Co:0 to 0.30, P:0 to 0.10%, B:0 to 0.05%, Mn:0 to 0.20%, Sn:0 to 0.40%, Ti:0 to 0.50%, Zr:0 to 0.20%, Si:0 to 0.50%, Fe:0 to 0.30%, Zn:0 to 1.00% and the balance Cu with inevitable impurities, number density of coarse Ni-Al-based precipitate particle with longer diameter of 5.0 μm or more in an observation surface in parallel to a sheet surface (rolling surface) of 5.0×10piece/mmor less and a KAM value measured by EBSD of 1.50 to 5.00°.SELECTED DRAWING: None
Inventors:
SHUDO TOSHIYA
SUDA HISASHI
SUDA HISASHI
Application Number:
JP2017117209A
Publication Date:
January 10, 2019
Filing Date:
June 14, 2017
Export Citation:
Assignee:
DOWA METALTECH KK
International Classes:
C22C9/06; C22F1/08; H01B1/02; H01B5/02; H01B13/00
Domestic Patent References:
| JPH06128708A | 1994-05-10 | |||
| JPS59159958A | 1984-09-10 | |||
| JP2017057476A | 2017-03-23 |
Foreign References:
| WO2012081573A1 | 2012-06-21 |
Attorney, Agent or Firm:
Komatsu Taka