Title:
CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JP2019009361
Kind Code:
A
Abstract:
To provide a ceramic electronic component with a metal terminal capable of being welded and mounted even when a mounting board is warped or a connecting portion is not in one plane due to a step difference, and a mounting structure thereof.SOLUTION: A part of a first metal terminal 140a and a second metal terminal 140b formed of lead wires are covered with an exterior resin material 170. The first metal terminal includes a first terminal joining portion, a first extension portion 144 connected to the joining portion and extending in the direction of the mounting surface, and a first mounting portion 146 connected to the extension portion and extending to the side opposite to the electronic component main body side. The second metal terminal includes a second terminal joining portion, a second extension portion 154 extending in the direction of the mounting surface, and a second mounting portion 156 connected to the extension portion and extending to the side opposite to the electronic component main body side. A first convex portion 146a and a second convex portion 156a which protrude toward the mounting surface side are respectively provided in the first mounting portion and the second mounting portion, and in the exterior resin material, protrusions protruding toward the mounting surface side are arranged.SELECTED DRAWING: Figure 1
Inventors:
AKIYOSHI TEPPEI
Application Number:
JP2017125650A
Publication Date:
January 17, 2019
Filing Date:
June 27, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/228; H01G2/06; H01G4/12; H01G4/232; H01G4/30
Attorney, Agent or Firm:
Masahiro Okada
Ichi Ogiya
Ichi Ogiya