Title:
MEMS TRANSDUCER MANUFACTURING METHOD, MEMS TRANSDUCER, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS
Document Type and Number:
Japanese Patent JP2019016934
Kind Code:
A
Abstract:
To provide an MEMS transducer manufacturing method, an MEMS transducer, an ultrasonic probe, and an ultrasonic diagnostic apparatus capable of connecting a MEMS substrate and an electronic circuit substrate with high precision at low cost.SOLUTION: An MEMS transducer manufacturing method includes a step of manufacturing a substrate 101 (corresponding to an MEMS substrate according to the present invention) having a plurality of diaphragms 22a formed on a substrate by forming an opening portion 101d from one surface after having formed a piezoelectric material layer 103 the other surface by using an MEMS technology, a step of aligning the substrate 101 with a substrate 401 (corresponding to an electronic circuit substrate according to the present invention) on which a signal detection circuit 400 is formed by using at least one of the plurality of diaphragms 22a as an alignment diaphragm, and a step of bonding the substrate 101 and the substrate 401.SELECTED DRAWING: Figure 5
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Inventors:
NAKAYAMA YUTA
Application Number:
JP2017133827A
Publication Date:
January 31, 2019
Filing Date:
July 07, 2017
Export Citation:
Assignee:
KONICA MINOLTA INC
International Classes:
H04R31/00; A61B8/14; H01L41/053; H01L41/08; H01L41/09; H01L41/113; H01L41/187; H01L41/25; H01L41/311; H04R17/00
Domestic Patent References:
| JP2007276157A | 2007-10-25 | |||
| JP2013539254A | 2013-10-17 | |||
| JP2004363746A | 2004-12-24 | |||
| JP2016181840A | 2016-10-13 |
Attorney, Agent or Firm:
Koichi Washida
Takashi Kiso
Takashi Kiso