Title:
ELECTRON MODULE
Document Type and Number:
Japanese Patent JP2019021905
Kind Code:
A
Abstract:
To provide an electron module arranged so that a hollow part of a hollow electronic component is hardly crushed by a pressure when filling a sealing resin.SOLUTION: An electron module comprises: a substrate 1 having a first principal face 1A and a second principal face 1B; a first electronic component 4 having a mount face to the substrate 1, a plurality of electrodes 7 formed on the mount face, and having a hollow part 5; a second electronic component 11 having a mount face on the substrate 1, a plurality of electrodes 12 formed on the mount face, and having no hollow part; and a sealing resin 13. The first electronic component 4 is mounted on the first principal face 1A of the substrate 1 and sealed by the sealing resin 13. The second electronic component 11 is mounted on the second principal face 1B of the substrate 1 and not sealed by the sealing resin 13.SELECTED DRAWING: Figure 1
Inventors:
YASUDA JUNPEI
Application Number:
JP2018081931A
Publication Date:
February 07, 2019
Filing Date:
April 21, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01L25/065; H01L23/00; H01L23/28; H01L23/29; H01L23/31; H01L25/00; H01L25/07; H01L25/18; H03H9/25
Domestic Patent References:
| JP2014209565A | 2014-11-06 | |||
| JP2013522880A | 2013-06-13 | |||
| JP2011222704A | 2011-11-04 |
Foreign References:
| US20160225745A1 | 2016-08-04 | |||
| US20160035593A1 | 2016-02-04 | |||
| CN105103285A | 2015-11-25 | |||
| CN105845661A | 2016-08-10 | |||
| CN102263069A | 2011-11-30 |
Attorney, Agent or Firm:
Nao Kawamoto