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Title:
CONDUCTIVE ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2019026821
Kind Code:
A
Abstract:
To provide a conductive adhesive tape and a method for producing the same.SOLUTION: There are provided a conductive adhesive tape and a method for producing the same. More specifically, in the conductive adhesive tape and the method for producing the same, a conductive adhesive tape is produced by applying an adhesive produced by mixing conductive powder which has an outer surface coated with conductive metal and is deformable in compression and an adhesive resin with a predetermined ratio, onto one surface or both surfaces of a base material having conductivity, which contains conductive powder that solves a projection phenomenon by characteristics that are deformable by a pressure, enables the adhesive tape to be uniformly and easily brought into contact with a stuck surface and is deformable in compression.SELECTED DRAWING: Figure 1A

Inventors:
MOON HO SEUP
Application Number:
JP2017247270A
Publication Date:
February 21, 2019
Filing Date:
December 25, 2017
Export Citation:
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Assignee:
TRUSS CO LTD
MOON HO SEUP
International Classes:
C09J7/20; B32B27/00; C09J9/02; C09J11/08; C09J201/00; H01B1/00; H01B1/22; H01R11/01; H01R43/00
Domestic Patent References:
JP2010508416A2010-03-18
JP2015023268A2015-02-02
JP2013171656A2013-09-02
JP2012190795A2012-10-04
JP2016001562A2016-01-07
JP2002294190A2002-10-09
JP2012021140A2012-02-02
JPH09143252A1997-06-03
JP2013127041A2013-06-27
JP2013249334A2013-12-12
JP2015010110A2015-01-19
Foreign References:
WO2016186099A12016-11-24
WO2012164836A12012-12-06
Attorney, Agent or Firm:
Ken Ieiri