Title:
SOLID STATE IMAGING DEVICE
Document Type and Number:
Japanese Patent JP2019033136
Kind Code:
A
Abstract:
To make it possible to suppress noise.SOLUTION: A solid state imaging device includes a first chip and a second chip bonded to the first chip, and the first chip has an anode potential, and the second chip includes pixels arranged in a matrix, a cathode arranged for each pixel, and an anode that constitutes a photodiode together with the cathode and is connected to the anode potential of the first chip independently for each of the pixels. The present disclosure can be used as an imaging device of a camera that shoots a subject.SELECTED DRAWING: Figure 8
Inventors:
KOBAYASHI KENJI
WAKANO HISASHI
OTAKE YUSUKE
WAKANO HISASHI
OTAKE YUSUKE
Application Number:
JP2017151980A
Publication Date:
February 28, 2019
Filing Date:
August 04, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP
International Classes:
H01L27/146; H01L31/10; H04N5/369
Domestic Patent References:
| JP2013089919A | 2013-05-13 | |||
| JP2017033962A | 2017-02-09 | |||
| JP2016192551A | 2016-11-10 |
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yoshio Inamoto