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Patent Searching and Data


Title:
SENSOR BALL AND SENSOR MODULE
Document Type and Number:
Japanese Patent JP2019042502
Kind Code:
A
Abstract:
To provide a sensor ball and a sensor module enabling obtaining sufficient impact resistance performance assuming a real ball catching action to an electronic device such as a sensor and a communication device, in the sensor ball and the sensor module capable of detecting the behavioral information of a ball.SOLUTION: In a sensor ball and a sensor module, the inside of a hollow capsule is filled with a filler comprising gel or silicone rubber, and an electronic unit for detecting the behavioral information of a ball is housed and supported in the hollow capsule by the filler. In the sensor ball, the outside of the hollow capsule is coated with a cover layer of at least one layer.SELECTED DRAWING: Figure 1

Inventors:
SHIBATA SHOHEI
NARUO TAKESHI
NAKA HIROSATO
YAMAMOTO MICHIHARU
MORI MASAKI
Application Number:
JP2018158843A
Publication Date:
March 22, 2019
Filing Date:
August 28, 2018
Export Citation:
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Assignee:
MIZUNO KK
AICHI STEEL WORKS LTD
International Classes:
A63B43/00; A63B37/00; A63B69/00
Domestic Patent References:
JP2005162924A2005-06-23
JP3046941U1998-03-24
JP2016220904A2016-12-28
Foreign References:
KR101644502B12016-08-02