Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2019042763
Kind Code:
A
Abstract:
To provide a laser processing method and a laser processing device capable of properly forming a periodic structure on a flat surface of a material.SOLUTION: A laser processing method comprises a flattening proces of forming a processing flat surface flattened by processing a projection part P of a processing object surface Wa by scanning while applying a pulse laser beam to the processing object surface Wa having irregularities. This flattening process forms the processing flat surface by processing the processing object surface Wa by a pulse laser beam (an energy ball E1) of removably adjusting a projection part P of the processing object surface Wa and formably adjusting a nano periodic structure based on the wave length of the pulse laser beam, in the final scanning of the pulse laser beam for forming the processing flat surface.SELECTED DRAWING: Figure 11
Inventors:
SERA HIROSHI
ISHIDA HIROSHI
WAKABAYASHI TOMOTAKA
SHIRASU KENJI
TAKUSHIMA YUICHI
EN KIO
KOBAYASHI TOMOKI
ISHIDA HIROSHI
WAKABAYASHI TOMOTAKA
SHIRASU KENJI
TAKUSHIMA YUICHI
EN KIO
KOBAYASHI TOMOKI
Application Number:
JP2017167699A
Publication Date:
March 22, 2019
Filing Date:
August 31, 2017
Export Citation:
Assignee:
YAZAKI CORP
KEIO GIJUKU
KEIO GIJUKU
International Classes:
B23K26/352; B23K26/00
Attorney, Agent or Firm:
Toranomon Intellectual Property Office