Title:
RESIN SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR USING RESIN SHEET
Document Type and Number:
Japanese Patent JP2019042976
Kind Code:
A
Abstract:
To provide a resin sheet which prevents floating on an interface between a resin composition layer and a support sheet even when tackiness on a surface of the resin composition layer is small, and easily peels the support sheet from a formed cured layer even when being used for a method for manufacturing a semiconductor device of peeling the support sheet from the cured layer after the resin composition layer has been thermoset.SOLUTION: A resin sheet 1 is used for sealing an electronic component 2, where the resin sheet 1 includes a first support sheet 11 and a curable resin composition layer 10, the resin composition layer 10 is formed from a resin composition containing a thermosetting resin and inorganic fine particles, the fine particles have a content of 50-90 mass% and an average particle diameter of 0.01-3.0 μm, the first support sheet 11 includes a support base material 111 and an adhesive layer 112, and the resin composition layer 10 is laminated on the surface of the adhesive layer 112 side.SELECTED DRAWING: Figure 1
Inventors:
NEZU YUSUKE
WATANABE YASUTAKA
SUGINO TAKASHI
WATANABE YASUTAKA
SUGINO TAKASHI
Application Number:
JP2017166582A
Publication Date:
March 22, 2019
Filing Date:
August 31, 2017
Export Citation:
Assignee:
LINTEC CORP
International Classes:
B32B27/20; C08K3/00; C08L101/00; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
| JP2014192238A | 2014-10-06 | |||
| JP2013048284A | 2013-03-07 | |||
| JP2017088758A | 2017-05-25 |
Foreign References:
| WO2017038913A1 | 2017-03-09 |
Attorney, Agent or Firm:
Yuji Hayakawa
Keisuke Murasame
Iida Riki
Keisuke Murasame
Iida Riki