Title:
MANUFACTURING METHOD OF MULTILAYER SUBSTRATE, MANUFACTURING METHOD OF COMPONENT MOUNTING SUBSTRATE, MULTILAYER SUBSTRATE AND COMPONENT MOUNTING SUBSTRATE
Document Type and Number:
Japanese Patent JP2019057694
Kind Code:
A
Abstract:
To provide a manufacturing method of a multilayer substrate which has the stable connection resistance value and high connection reliability in an interlayer connection part, and enables printing formation of a uniform insulation layer onto the interlayer connection part and component mounting, a manufacturing method of a component mounting substrate, the multilayer substrate and the component mounting substrate.SOLUTION: A manufacturing method of a multilayer substrate 100 includes: a process of forming a through hole 1 with punching processing so that a front surface circuit pattern 2 and a rear surface circuit pattern 3 are formed on the front surface and rear surface of an insulation substrate 4, and a portion of at least one circuit pattern on the front surface and rear surface of the insulation substrate 4 extends along the inner wall of the through hole 1 of the insulation substrate 4; and a process of forming an interlayer connection part 6 by filling the inside and circumference of the through hole 1 with the conductive paste by printing from both of the front surface and rear surface of the insulation substrate 4.SELECTED DRAWING: Figure 1B
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Inventors:
SASAOKA NORIFUMI
TAGUCHI KOJI
KATSUMATA MASAAKI
TAGUCHI KOJI
KATSUMATA MASAAKI
Application Number:
JP2017182701A
Publication Date:
April 11, 2019
Filing Date:
September 22, 2017
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H05K1/11; H05K3/00; H05K3/40
Domestic Patent References:
| JPH1051095A | 1998-02-20 | |||
| JPH0823168A | 1996-01-23 | |||
| JPH06112640A | 1994-04-22 | |||
| JP2013254910A | 2013-12-19 | |||
| JP2006179519A | 2006-07-06 | |||
| JP2005166940A | 2005-06-23 |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office