Title:
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2019062134
Kind Code:
A
Abstract:
To improve the connection reliability of an electronic component incorporated in a core substrate.SOLUTION: A printed circuit board incorporating a plurality of electronic components in a component housing part of a core substrate has a plurality of thickness adjustment openings in an outer peripheral frame outside and/or inside a product area including a component housing part of the core substrate, and an interlayer insulating layer is formed on the core substrate, and the resin component of the interlayer insulating layer is filled into the component housing part and flows into the thickness adjustment opening.SELECTED DRAWING: Figure 2
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Inventors:
MIKADO YUKINOBU
MATSUI YOSHIKI
IKEDA KOSUKE
MATSUI YOSHIKI
IKEDA KOSUKE
Application Number:
JP2017187342A
Publication Date:
April 18, 2019
Filing Date:
September 28, 2017
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02; H01L23/12; H01L25/00; H01L25/04; H01L25/18; H05K3/46
Attorney, Agent or Firm:
Ginza Marronnier Patent Office