Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
Japanese Patent JP2019073620
Kind Code:
A
Abstract:
To provide a thermoplastic resin composition which is small in a water absorption dimensional change and is excellent in low temperature impact property, weld strength and slidability, and a molded body.SOLUTION: There is provided a thermoplastic resin composition which contains (a) a polyphenylene ether resin, (b) aliphatic polyamide, (c) polyhexamethylene isophthalamide (PA6I), (d) a hydrogenated block copolymer formed by hydrogenating a block copolymer formed of a polymer block A and a polymer block B and/or a modified product of the hydrogenated block copolymer, and (e) a compatibility accelerator of the component (a), the component (b) and the component (c), and in which a content of the component (a) is 10-65 pts.mass, the total content of the component (b) and the component (c) is 35 to 90 pts.mass, a content of the component (d) is 1 to 30 pts.mass, and a content of the component (e) is 0.01 to 5 pts.mass, and formic acid relative viscosity (RV) of the component (c) is 8 or more and 20 or less. There is also provided a molded body.SELECTED DRAWING: None
More Like This:
| WO/2001/081451 | MODIFIED POLYPHENYLENE ETHER RESIN |
| JP2013001772 | FLAME-RETARDANT THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDING |
Inventors:
INAGAKI MARE
TOKUYAMA MIKI
TOKUYAMA MIKI
Application Number:
JP2017200408A
Publication Date:
May 16, 2019
Filing Date:
October 16, 2017
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08L71/12; C08K5/1539; C08L53/02; C08L77/00
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro God
Mitsutsugu Sugimura
Koichiro God