Title:
SEMICONDUCTOR MODULE UNIT
Document Type and Number:
Japanese Patent JP2019075842
Kind Code:
A
Abstract:
To provide a semiconductor module unit capable of improving assembling workability and reducing noise generation.SOLUTION: A semiconductor module unit 1A is provided with: a semiconductor module 3A; and a control board 2 that has a driver circuit 52 for outputting a driving signal to the semiconductor module 3A and controls the semiconductor module 3A. The control board 2 is provided with a main board 4, a sub-board 5A which is separated from the main board 4 and on which the driver circuit 52 is mounted, and a flexible board 6 which has flexibility and electrically connects the main board 4 and the sub-board 5A to each other. The sub-board 5A has a fitting part 53 which is fitted to a fitted part 23 of the semiconductor module 3A. The semiconductor module 3A is electrically connected to the driver circuit 52 in a state where the fitting part 53 is fitted to the fitted part 23.SELECTED DRAWING: Figure 3
Inventors:
MORIMOTO MITSUAKI
OISHI EIICHIRO
OISHI EIICHIRO
Application Number:
JP2017198252A
Publication Date:
May 16, 2019
Filing Date:
October 12, 2017
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H02M7/48; H05K1/14; H05K3/32
Domestic Patent References:
| JPH10146066A | 1998-05-29 | |||
| JP2012129491A | 2012-07-05 | |||
| JP2016220277A | 2016-12-22 |
Attorney, Agent or Firm:
Toranomon Intellectual Property Office