Title:
YEAST PIE
Document Type and Number:
Japanese Patent JP2019080523
Kind Code:
A
Abstract:
To provide a yeast pie in which the eat-texture has crispy-feeling, good crunchiness and collapse feeling; and a yeast pie dough for producing said yeast pie.SOLUTION: Provided is a yeast pie dough in which 7 to 25 pts.mass of the following oil/fat composition A for kneading are kneaded into 100 pts.mass of grain flour. Oil/fat composition A for kneading: an oil/fat composition for kneading in which the solid fat content of the oil/fat contained is 60% or more at 5°C, 25 to 45% at 15°C, 10 to 35% at 20°C, and 3 to 15% at 35°C.SELECTED DRAWING: None
Inventors:
KATAOKA NAOTO
KUMAGAI KENICHI
KUMAGAI KENICHI
Application Number:
JP2017209765A
Publication Date:
May 30, 2019
Filing Date:
October 30, 2017
Export Citation:
Assignee:
NISSHIN OILLIO GROUP LTD
International Classes:
A23D9/00; A21D6/00; A21D15/08
Domestic Patent References:
| JP2010057405A | 2010-03-18 | |||
| JP2010148471A | 2010-07-08 | |||
| JP2004305048A | 2004-11-04 |