Title:
UNDERLYING COATING COMPOSITIONS FOR USE WITH PHOTORESISTS
Document Type and Number:
Japanese Patent JP2019082682
Kind Code:
A
Abstract:
To provide new composition and methods that include antireflective compositions that can exhibit enhanced etch rates in standard plasma etchants.SOLUTION: A method for forming a photoresist relief image, comprises: a) applying on a substrate a layer of a coating composition comprising a resin comprising repeat units that comprise a structure of the following Formula (I), where R1, R2 and R3 are each independently hydrogen or a non-hydrogen substituent, with at least one of R1, R2 and R3 is -(CXY)(C=O)O-R where R is linkage to another polymer unit and X and Y are each independently hydrogen or a non-hydrogen substituent; and b) applying a layer of a photoresist composition on the coating composition layer.SELECTED DRAWING: None
Inventors:
LEE JUNG-JUNE
AHN JAE-YUN
SHIN YOU RIM
PARK JIN HONG
SIM JAE-HWAN
AHN JAE-YUN
SHIN YOU RIM
PARK JIN HONG
SIM JAE-HWAN
Application Number:
JP2018194112A
Publication Date:
May 30, 2019
Filing Date:
October 15, 2018
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT KOREA LTD
International Classes:
G03F7/11; C08G63/685; G03F7/20
Foreign References:
| WO2004034148A1 | 2004-04-22 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office