Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019091886
Kind Code:
A
Abstract:
To provide a substrate processing apparatus capable of efficiently processing the entire back surface of a substrate including the outermost part with the back surface of the substrate facing downward.SOLUTION: A substrate processing apparatus includes a plurality of rotatable rollers 11 each having a substrate holding surface 11a for holding the peripheral portion of a substrate W, a scrub head 50 for pressing a scrubbing tool 31 against the lower surface 1 of the substrate W, a rotating shaft 55 extending parallel to the axes of the plurality of rollers 11, a connecting member 57 connecting the scrub head 50 to the rotating shaft 55, and a head rotation mechanism 70 for rotating the rotating shaft 55. The scrub head 50 is eccentric from the axial center SC of the rotating shaft 55.SELECTED DRAWING: Figure 1
Inventors:
KODERA KENJI
NAKANISHI MASAYUKI
NAKANISHI MASAYUKI
Application Number:
JP2018188817A
Publication Date:
June 13, 2019
Filing Date:
October 04, 2018
Export Citation:
Assignee:
EBARA CORP
International Classes:
H01L21/304
Domestic Patent References:
| JP2000223460A | 2000-08-11 | |||
| JP2003007666A | 2003-01-10 | |||
| JP2015233091A | 2015-12-24 | |||
| JP2015002261A | 2015-01-05 | |||
| JP2008177541A | 2008-07-31 |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe