Title:
SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
Japanese Patent JP2019093474
Kind Code:
A
Abstract:
To efficiently perform processing for thinning a substrate.SOLUTION: The substrate processing system comprises: a chuck 101 for holding a wafer; cutting units 160, 170 and 180 for cutting a processed surface of the wafer; an alignment unit 120 for aligning a horizontal direction of the wafer which is not held by the chuck 101; a second cleaning unit 140 that cleans an unprocessed surface of a wafer W subjected to grinding processing, which is held by a carrying pad 114; and a carrying unit 110 that carries the wafer while holding the wafer with the carrying pad 114 and carries the wafer to a delivery position A0 where the wafer is delivered to the chuck 101, the alignment unit 120 and the second cleaning unit 140.SELECTED DRAWING: Figure 3
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Inventors:
KODAMA MUNEHISA
Application Number:
JP2017224650A
Publication Date:
June 20, 2019
Filing Date:
November 22, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
B24B7/00; B24B7/04; H01L21/304; H01L21/677
Domestic Patent References:
| JP2019021859A | 2019-02-07 | |||
| JP2011124249A | 2011-06-23 | |||
| JP2002343756A | 2002-11-29 | |||
| JP2007027577A | 2007-02-01 |
Foreign References:
| US20140209239A1 | 2014-07-31 |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Koji Hagiwara
Naoki Ogita
Koji Hagiwara
Naoki Ogita