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Title:
INSULATING HEAT TRANSFER SUBSTRATE, THERMOELECTRIC CONVERSION MODULE, AND METHOD OF MANUFACTURING INSULATING HEAT TRANSFER SUBSTRATE
Document Type and Number:
Japanese Patent JP2019102808
Kind Code:
A
Abstract:
To provide an insulating heat transfer substrate which has sufficient insulation and high heat conductivity and can be manufactured relatively easily, a thermoelectric conversion module using the same, and a method of manufacturing the insulating heat transfer substrate.SOLUTION: The insulating heat transfer substrate includes: heat transfer layers 21, 31 made of aluminum or aluminum alloy; conductive layers 25, 35 disposed on one side of the heat transfer layers 21, 31; and glass layers 23, 33 formed between the conductive layers 25, 35 and the heat transfer layers 21, 31. The conductive layers 25, 35 are made of a silver sintered body. Thicknesses tg of the glass layers 23, 33 are in a range of 5 μm to 50 μm.SELECTED DRAWING: Figure 2

Inventors:
ARAI KOYA
NISHIMOTO SHUJI
KOMAZAKI MASAHITO
NAGATOMO YOSHIYUKI
KUROMITSU YOSHIO
Application Number:
JP2018217595A
Publication Date:
June 24, 2019
Filing Date:
November 20, 2018
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
H01L35/30
Domestic Patent References:
JP2017059823A2017-03-23
JP2017157599A2017-09-07
JP2013168431A2013-08-29
JP2008244100A2008-10-09
JP2006237146A2006-09-07
JP2008078222A2008-04-03
JP2014011469A2014-01-20
Foreign References:
WO2017150096A12017-09-08
EP3425660A12019-01-09
US20150035137A12015-02-05
WO2013122126A12013-08-22
EP2816593A12014-12-24
US20190058101A12019-02-21
WO2017047627A12017-03-23
EP3352233A12018-07-25
US20190027380A12019-01-24
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami



 
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