Title:
SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JP2019104956
Kind Code:
A
Abstract:
To provide a sputtering apparatus capable of suppressing variation in sputtered particle reach amount in the surface of an object to be deposited.SOLUTION: A sputtering apparatus comprises: a cathode rocking part 20 for rocking a target 21 connected to a power supply 52 in a conveying direction D1; a shield 16 positioned on the front side of the target 21 and having an open hole 16a facing the target 21; a conveyance part 15 for facing the target 21 with an object S to be deposited through the open hole 16a while conveying the object S to be deposited in the conveying direction D1 on the front side of the target 21; and a magnetic circuit 30 positioned on the back side of the target 21 and capable of fixing a position of the shield 16 in the conveying direction D1 and overlapping a position in the conveying direction D1 with a position of the open hole 16a in conveying direction D1. A first target member 21A and second target member 21B included in the target 21 are arranged in the conveying direction D1 and have the state of facing the object S to be deposited through the open hole 16a.SELECTED DRAWING: Figure 2
Inventors:
SUDA TOMOKAZU
TAKAHASHI AKIHISA
SAITO SHUJI
TAKAHASHI AKIHISA
SAITO SHUJI
Application Number:
JP2017237306A
Publication Date:
June 27, 2019
Filing Date:
December 12, 2017
Export Citation:
Assignee:
ULVAC CORP
International Classes:
C23C14/35
Domestic Patent References:
| JP2014114498A | 2014-06-26 | |||
| JPH0578837A | 1993-03-30 | |||
| JPS5985864A | 1984-05-17 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda