Title:
WIRING BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2019121662
Kind Code:
A
Abstract:
To provide a technique advantageous for shielding a wiring pattern disposed on a wiring board.SOLUTION: The wiring board includes a plurality of wiring layers, each having a wiring pattern disposed thereon. A conductive film is disposed on a side of the wiring board. The plurality of wiring layers includes a first wiring layer, a second wiring layer, and a third wiring layer between the first wiring layer and the second wiring layer. Each of the first wiring layer and the second wiring layer includes a first wiring pattern connected to the conductive film. The conductive film covers a portion of the side surface between the first wiring layer and the second wiring layer.SELECTED DRAWING: Figure 1
Inventors:
OSHIMA YASUHIRO
Application Number:
JP2017254729A
Publication Date:
July 22, 2019
Filing Date:
December 28, 2017
Export Citation:
Assignee:
CANON COMPONENTS KK
International Classes:
H05K1/02; H01L23/12; H05K3/46; H05K9/00
Attorney, Agent or Firm:
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu