Title:
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2019121666
Kind Code:
A
Abstract:
To provide a semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device that can improve flatness of a semiconductor wafer fixed and held on a surface of a stage.SOLUTION: There is provided a semiconductor manufacturing apparatus that performs exposure processing on a principal surface of a semiconductor wafer 11 sucked on a stage 1, and a plurality of suction grooves 3 are provided concentrically on a suction surface 2 of the stage 1 at narrow intervals w1 of less than 12 mm. After the semiconductor wafer 11 is mounted on the suction surface 2 of the stage 1 to close the suction grooves 3, negative pressure (suction pressure) is produced in the suction grooves 3 to a predetermined set value in a direction of drawing the semiconductor wafer 11 toward the stage 1 by evacuating the suction grooves 3, thereby sucking the semiconductor wafer 11 to the suction grooves 3. The set value of the negative pressure is equal to or larger than a threshold, and -25 to -50 kPa at which unevenness formed on a semiconductor substrate is equal to or less than a depth of focus of the exposure processing. The threshold of the negative pressure is a lower-limit value of the negative pressure with which the suction of the semiconductor wafer 1 to the suction grooves 3 can be maintained until the end of the exposure processing.SELECTED DRAWING: Figure 2
Inventors:
KITAHARA KAZUHIRO
KODAMA NAOKO
KODAMA NAOKO
Application Number:
JP2017255007A
Publication Date:
July 22, 2019
Filing Date:
December 28, 2017
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/683; G03F7/20; G03F7/207; G03F9/00
Domestic Patent References:
| JPH01319965A | 1989-12-26 | |||
| JPH0851143A | 1996-02-20 | |||
| JPH07135161A | 1995-05-23 | |||
| JP2001332609A | 2001-11-30 |
Attorney, Agent or Firm:
Akinori Sakai