Title:
RESIN COMPOSITION FOR INTERLAYER INSULATION LAYER, RESIN FILM FOR INTERLAYER INSULATION LAYER, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2019123799
Kind Code:
A
Abstract:
To provide a resin composition for an interlayer insulation layer achieving both low thermal expansion property and adhesiveness to a conductor layer, a resin film for an interlayer insulation layer using the resin composition for an interlayer insulation layer, a multilayer printed wiring board, a semiconductor package and a method for manufacturing a multilayer printed wiring board.SOLUTION: The resin composition for an interlayer insulation layer comprises (A) a thermosetting resin and (B) an inorganic filler. The content of the (B) inorganic filler in the resin composition for an interlayer insulation layer is 55 to 90 vol.%. The (B) inorganic filler comprises (B1) a nano-filler and (B2) a spherical filler having an average particle diameter larger than that of the (B1) nano-filler. The content of the (B1) nano-filler in the resin composition for an interlayer insulation layer is 0.3 to 2 vol.%. The present invention also provides a resin film for an interlayer insulation layer using the above resin composition for an interlayer insulation layer, a multilayer printed wiring board, a semiconductor package and a method for manufacturing a multilayer printed wiring board.SELECTED DRAWING: Figure 1
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Inventors:
SUZUKAWA TAKAYUKI
MATSUURA MASAHARU
TABATA SHIORI
MATSUURA MASAHARU
TABATA SHIORI
Application Number:
JP2018005115A
Publication Date:
July 25, 2019
Filing Date:
January 16, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L101/00; B32B27/18; B32B27/36; C08K3/00; C08K3/36; C08K7/00; C08K7/18; C08K9/06; H05K1/03; H05K3/38; H05K3/46
Domestic Patent References:
| JP2012062422A | 2012-03-29 | |||
| JP2015189848A | 2015-11-02 | |||
| JPH10130470A | 1998-05-19 | |||
| JP2011026419A | 2011-02-10 | |||
| JP2006036916A | 2006-02-09 | |||
| JP2018518563A | 2018-07-12 |
Foreign References:
| WO2013065758A1 | 2013-05-10 | |||
| WO2013065159A1 | 2013-05-10 |
Attorney, Agent or Firm:
Kenichi Hirasawa
Kosuke Sawayama
Kosuke Sawayama