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Patent Searching and Data


Title:
BUILDING STRUCTURE
Document Type and Number:
Japanese Patent JP2019124117
Kind Code:
A
Abstract:
To provide a building structure capable of securing a certain wall part on the side below a through-hole formed in a wall, while making an up-grade of piping small.SOLUTION: A building structure of the present invention includes: a top surface 1f of a first slab 1; a top surface 2f of a second slab 2 lower than the top surface 1f of the first slab; a wall 4 that is formed on the top surface 2f of the second slab; and a siphon drain pipe 20 that penetrates the wall 4a through the through-hole 4a formed in the wall 4. A height from the top surface 2f of the second slab at a lower end of the through-hole 4a is 30 mm or more.SELECTED DRAWING: Figure 2

Inventors:
MARUYAMA HIDEYUKI
TOYODA HIDEJI
HOSODA YUKIHIRO
WAKABAYASHI TORU
KUBO KATSUYUKI
YOSHIHAMA SORAHIRO
YAMAGA HIDEO
Application Number:
JP2019068243A
Publication Date:
July 25, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
BRIDGESTONE CORP
HASEGAWA KOMUTEN KK
International Classes:
E04B5/48; E03C1/122
Domestic Patent References:
JPH026613B21990-02-13
JP2001090135A2001-04-03
JP2007315036A2007-12-06
JPH11148153A1999-06-02
JPH06129003A1994-05-10
JP2002302980A2002-10-18
Foreign References:
KR101150282B12012-05-24
US20060237678A12006-10-26
Attorney, Agent or Firm:
Kenji Sugimura
Osamu Suzuki
Kotaro Sakamoto