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Title:
MOLD RELEASE PROCESSING METHOD AND IMPRINT APPARATUS
Document Type and Number:
Japanese Patent JP2019126954
Kind Code:
A
Abstract:
To provide a mold release processing method capable of carrying out a mold release process simply and stably.SOLUTION: A mold release processing method is a mold release processing method in which a mold release film is formed on a surface of an imprint mold, a mold release agent containing a volatile component is applied to a surface of a coating roll, and the mold release agent is applied to a surface of the mold by scanning the coating roll while bringing the surface of the coating roll into contact with the surface of the mold. By heating the mold release agent applied to the surface of the mold, the volatile component are volatilized to form a release film on the surface of the mold.SELECTED DRAWING: Figure 1

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Inventors:
WADA NORIHIKO
Application Number:
JP2018009396A
Publication Date:
August 01, 2019
Filing Date:
January 24, 2018
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
B29C33/58; B29C33/38; B29C59/02; B29C59/04
Domestic Patent References:
JP2011192868A2011-09-29
JP2017159526A2017-09-14
JPH08250526A1996-09-27
Foreign References:
WO2011089836A12011-07-28
Attorney, Agent or Firm:
Hiromori Arai
Eisaku Teratani
Shinichi Michisaka



 
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