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Title:
SUBSTRATE CLEANING BRUSH AND SUBSTRATE WASHING APPARATUS
Document Type and Number:
Japanese Patent JP2019129248
Kind Code:
A
Abstract:
To provide a technique for effectively performing a particle removing in an outer peripheral part of a blush.SOLUTION: A substrate cleaning brush 20 for cleaning a wafer 2, comprises: a blush main body 21; and a blush holding part 23. The blush main body 21 includes a structure in which a liquid can be impregnated, and a lower surface contacted to a substrate. The blush holding part 23 holds the blush main body 21 while exposing a tip part of a vertical direction d1 in the blush main body 21 to an outer side. The blush holding part 23 includes a main stream path 251 and a plurality of sub stream paths 252. The main stream path 251 can be formed so that a processing liquid supplied from an outer part can be passed. The plurality of sub stream paths 252 is branched from the main stream path 251, and extended to an outer direction of a width direction d2 orthogonal to the vertical direction d1 in the brush main body 21, and is connected to an upper surface of the blush main body 21.SELECTED DRAWING: Figure 3

Inventors:
HIRAOKA NOBUYASU
YANO WATARU
SHINOHARA TAKASHI
TANAKA KATSUNORI
Application Number:
JP2018010496A
Publication Date:
August 01, 2019
Filing Date:
January 25, 2018
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/304; B08B1/04; B08B3/04; B08B7/04
Domestic Patent References:
JP2008027959A2008-02-07
JP2002222788A2002-08-09
JP2002096037A2002-04-02
JP2015023165A2015-02-02
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita