Title:
PATTERN INSPECTION METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2019139104
Kind Code:
A
Abstract:
To provide a pattern inspection method and device capable of evaluating transfer property of a defect of a mask without information of a condition of a semiconductor process.SOLUTION: A pattern inspection method of an embodiment is a pattern inspection method using a pattern inspection device which comprises: a stage on which a mask can be mounted and which is movable; an optic system for acquiring an optical image of a mask; a reference system for generating a reference image corresponding to an optical image based on design data of the mask; and a control system for detecting a defect of the mask using the optical image. The method comprises a step for, based on the design data or the optical image, recognizing a selected certain shape out of pattern shapes drawn on the mask as a representative pattern shape by the control system; a step for estimating an illumination condition when a pattern is transferred by an exposure device based on the representative pattern shape; a step for inputting the illumination condition to a transfer simulator for evaluating whether or not the defect on the mask is transferred to the board; and a step for executing the transfer simulator.SELECTED DRAWING: Figure 1
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Inventors:
INOUE TAKAFUMI
TSUCHIYA HIDEO
TSUCHIYA HIDEO
Application Number:
JP2018023336A
Publication Date:
August 22, 2019
Filing Date:
February 13, 2018
Export Citation:
Assignee:
NUFLARE TECHNOLOGY INC
International Classes:
G03F1/84; G01B11/24; G01N21/956; H01L21/027
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira