Title:
RELEASE LAYER FORMATION MATERIAL AND MANUFACTURING METHOD OF RELEASE PAPER
Document Type and Number:
Japanese Patent JP2019147856
Kind Code:
A
Abstract:
To provide a release layer formation material capable of forming a release layer directly on a substrate paper regardless of kinds of the substrate paper, and a simple manufacturing method of the release paper.SOLUTION: The release layer formation material contains a solvent-type, non-solvent-type or emulsion-type silicone having thixotropic nature. The manufacturing method of a release paper includes: preparing a paper constituting a substrate paper layer; applying such release layer formation material directly to the paper; and curing the release layer formation material and forming a release layer.SELECTED DRAWING: None
Inventors:
UEDA MASAYUKI
ARIMA HIROAKI
ARIMA HIROAKI
Application Number:
JP2018031753A
Publication Date:
September 05, 2019
Filing Date:
February 26, 2018
Export Citation:
Assignee:
MATSUMURA PAPER CO LTD
International Classes:
C09D183/04; B32B7/06; B32B27/10; D21H27/00
Domestic Patent References:
| JPH0657144A | 1994-03-01 | |||
| JP2005113002A | 2005-04-28 | |||
| JP2011252143A | 2011-12-15 | |||
| JP2014132091A | 2014-07-17 | |||
| JP2001278901A | 2001-10-10 | |||
| JPH06145201A | 1994-05-24 |
Attorney, Agent or Firm:
Katsuto Momii