Title:
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC ELEMENT MOUNTING MOTHERBOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2019149452
Kind Code:
A
Abstract:
To provide an electronic element mounting substrate that can reduce the risk of electrode damage due to contact or the like.SOLUTION: An electronic element mounting substrate 1 according to an embodiment of the present invention includes a substrate 2 on which an electronic element 10 is mounted on the upper surface, and an electrode pad 3 including a metal material located on the upper surface and/or the lower surface of the substrate 2. The electrode pad 3 includes a first part 3d including a metal film, and a second part 3e not including a metal film located continuously with the first part 3d.SELECTED DRAWING: Figure 1
Inventors:
MIURA KOJI
Application Number:
JP2018033242A
Publication Date:
September 05, 2019
Filing Date:
February 27, 2018
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L21/60; H01L23/12