Title:
SINGLE-SIDE POLISHING HEAD WITH RECESS AND CAP AND HAVING CENTER FLEXIBLE PORTION
Document Type and Number:
Japanese Patent JP2019153801
Kind Code:
A
Abstract:
To provide a polishing head assembly for single-side polishing capable of controlling the flatness of a silicon wafer.SOLUTION: A single-side polishing machine 100 has a head assembly 130 that includes a polishing head and a cap. The polishing head has a recess along the lower portion, and the recess has a concave surface. The cap is disposed in the recess and has an annular wall and a floor extending across the annular wall. The floor is spaced from the concave surface to form a chamber between the concave surface and the floor. The chamber is configured to be pressurized to deflect the floor. The annular wall is attached to the polishing head with an adhesive.SELECTED DRAWING: Figure 1
Inventors:
PETER ALBRECHT
SUMEET S BHAGAVAT
ALEX CHU
YOSHIMURA ICHIRO
XIN YUNBIAO
ROLAND VANDAMME
SUMEET S BHAGAVAT
ALEX CHU
YOSHIMURA ICHIRO
XIN YUNBIAO
ROLAND VANDAMME
Application Number:
JP2019081061A
Publication Date:
September 12, 2019
Filing Date:
April 22, 2019
Export Citation:
Assignee:
SUNEDISON SEMICONDUCTOR LTD
International Classes:
H01L21/304; B24B37/30
Domestic Patent References:
| JP2004327547A | 2004-11-18 | |||
| JPH07112364A | 1995-05-02 | |||
| JP2001179605A | 2001-07-03 | |||
| JP2013004928A | 2013-01-07 |
Attorney, Agent or Firm:
Takuji Yamada
Yasuo Yanagibashi
Yasuo Yanagibashi