Title:
PLATED RESIN MOLDING AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2019157142
Kind Code:
A
Abstract:
To provide a plated resin molding manufactured with a less load to the environment and capable of using even a resin except an ABS resin, and a method for manufacturing the same.SOLUTION: A plated resin molding 1 includes a resin containing base 3 and an electroless plating layer 5 formed on the surface of the base 3. A structure unit derived from a silane coupling agent is fixed to the surface of the base 3 by a covalent bond; the silane coupling agent has a functional group capable of capturing catalytic metal; the catalytic metal captured by the functional group bonds with the electroless plating layer; and 3-aminopropyl ethoxy silane is preferably used as a silane coupling agent.SELECTED DRAWING: Figure 2
Inventors:
SHIBATA MASAMI
ISHIGURO FUMIYASU
ISHIGURO FUMIYASU
Application Number:
JP2018040304A
Publication Date:
September 19, 2019
Filing Date:
March 07, 2018
Export Citation:
Assignee:
UNIV YAMANASHI
LIXIL CORP
LIXIL CORP
International Classes:
C23C18/30; C23C18/20
Attorney, Agent or Firm:
Patent Business Corporation Grund Patent Office