Title:
ELECTRONIC COMPONENT MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2019160924
Kind Code:
A
Abstract:
To provide an electronic component mounting method in which productivity can be improved while reducing falling risk of electronic components.SOLUTION: An electronic component mounting method includes: an information acquisition step of acquiring positional information or the like of a mounting position of a 3D circuit board; a rotation amount calculation step of calculating an amount of rotation around each axis of a stage so that the orientation of the mounting surface changes to the direction perpendicular to a mounting head, based on normal information on the mounting surface at each mounting position; a rotation amount selection step of selecting combination in which the amount of rotation around each axis of the stage is reduced regarding electronic components having high falling risk; and a mounting order calculation step of calculating the mounting order in which the total rotation amount is reduced indicating the total amount of the amount of rotation around each axis of the stage in the electronic components having low falling risk while putting the electronic components having high falling risk later in the mounting order and putting the electronic components having low falling risk earlier in the mounting order.SELECTED DRAWING: Figure 2
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Inventors:
MIYAKE TAKAHIRO
Application Number:
JP2018043191A
Publication Date:
September 19, 2019
Filing Date:
March 09, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K13/04
Domestic Patent References:
| JP2012119643A | 2012-06-21 | |||
| JP2012178393A | 2012-09-13 | |||
| JPS5875885A | 1983-05-07 |
Foreign References:
| WO2018216128A1 | 2018-11-29 | |||
| US20180243869A1 | 2018-08-30 |
Attorney, Agent or Firm:
Washeda International Patent Office
Koichi Washida
Koichi Washida