Title:
MOLDING APPARATUS, MOLDING METHOD, AND PROGRAM
Document Type and Number:
Japanese Patent JP2019162774
Kind Code:
A
Abstract:
To suppress a deterioration of molding efficiency.SOLUTION: A molding apparatus 10 is a molding apparatus for molding objects. The molding apparatus 10 includes a reception unit 80B, a detection unit 80D, and an output control unit 80C. The reception unit 80B accepts designation of a molding start scheduled time of the molding object. The detection unit 80D detects a change in a molding possible state of the molding apparatus 10. The output control unit 80C outputs change information indicating that a change has occurred in the molding possible state of the molding apparatus 10 when a change in the molding possible state is detected after receiving a designation of the molding start scheduled time.SELECTED DRAWING: Figure 4
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Inventors:
YUKIMOTO REIJI
Application Number:
JP2018051723A
Publication Date:
September 26, 2019
Filing Date:
March 19, 2018
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02
Domestic Patent References:
| JP2013067018A | 2013-04-18 |
Foreign References:
| WO2017221884A1 | 2017-12-28 |
Attorney, Agent or Firm:
Hiroaki Sakai