Title:
ELECTRONIC DEVICE AND ASSEMBLY METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2019165041
Kind Code:
A
Abstract:
To provide an electronic device capable of simplifying the assembly process while improving the seismic performance of the mounting board attached to the case.SOLUTION: An electronic device 10 comprises a mounting board 2, and a case 1 accommodating the mounting board 2. The mounting board 2 is fastened to the case 1 with at least one screw 3, and the corners of the mounting board 2, which are not fastened, are sandwiched between the notches of the ribs 1a to 1c provided in the case 1.SELECTED DRAWING: Figure 1
Inventors:
GUAN YINGCHUN
Application Number:
JP2018050365A
Publication Date:
September 26, 2019
Filing Date:
March 19, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K7/14
Attorney, Agent or Firm:
Osamu Tsuda
Koji Morita
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto
Koji Morita
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto
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