Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2019167428
Kind Code:
A
Abstract:
To provide a curable resin composition capable of forming a cured body which has high light transmissivity and is excellent in retention of the light transmissivity to an environmental load such as heat, and a cured body of the same.SOLUTION: A resin composition contains the following components (A) to (C): (A) a bisphenol AF type epoxy resin; (B) a thermoplastic resin containing a phenoxy resin; and (C) a curing accelerator containing phosphonium salt.SELECTED DRAWING: None
Inventors:
MATSUMURA ERI
OYAMA HIDEKI
HAYASHI EIICHI
OYAMA HIDEKI
HAYASHI EIICHI
Application Number:
JP2018055387A
Publication Date:
October 03, 2019
Filing Date:
March 22, 2018
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08G59/20; C08G59/68
Domestic Patent References:
| JP2017149861A | 2017-08-31 | |||
| JP2015010179A | 2015-01-19 | |||
| JP2017179058A | 2017-10-05 |
Attorney, Agent or Firm:
Takashima Ichi
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Hirofumi Toma
Atsuko Akai
Tomiya Tozaki
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Hirofumi Toma
Atsuko Akai
Tomiya Tozaki