Title:
SUBSTRATE INSPECTION DEVICE, SUBSTRATE PROCESSING DEVICE, SUBSTRATE INSPECTION METHOD, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019168232
Kind Code:
A
Abstract:
To provide a substrate inspection device with which it is possible to inspect a substrate with high reliability, and a substrate processing device, a substrate inspection method and a substrate processing method equipped with the substrate inspection device.SOLUTION: A plurality of image data indicating each of a plurality of substrate images are sequentially acquired by an image data acquisition unit 2. Determination of whether or not a substrate indicated by one or more image data among the plurality of image data acquired by the image data acquisition unit 2 includes a defect is made by a determination unit 3. The image data of a substrate determined not to include a defect by the determination unit 3 is set as reference data by a reference data setting unit 4. The other image data acquired by the image data acquisition unit 2 are compared with the reference data set by the reference data setting unit 4, and substrates corresponding to the other image data are inspected by an inspection unit 5.SELECTED DRAWING: Figure 3
Inventors:
MATSUO TOMOHIRO
NAKAGAWA KOJI
NAKAGAWA KOJI
Application Number:
JP2018053965A
Publication Date:
October 03, 2019
Filing Date:
March 22, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
G01N21/956; H01L21/027
Attorney, Agent or Firm:
Yoshito Fukushima
Masahiro Nakagawa
Sawamura Hideyuki
Masahiro Nakagawa
Sawamura Hideyuki