Title:
SUBSTRATE HOLDING DEVICE AND MANUFACTURING METHOD OF DRIVE RING
Document Type and Number:
Japanese Patent JP2019171492
Kind Code:
A
Abstract:
To provide a substrate holding device which can suppress variation in a polishing rate in a circumferential direction of a substrate.SOLUTION: A substrate holding device 1 includes a polishing head main body 10, a drive ring 81 arranged below the polishing head main body 10, and a retainer ring 40 fixed to the drive ring 81. The drive ring 81 has an annular contact surface contacting with the retainer ring 40, and flatness in a circumferential direction of the contact surface is 4.6 μm or less. The flatness indicates a difference of heights between the highest position and the lowest position of the contact surface.SELECTED DRAWING: Figure 3
Inventors:
NAMIKI KEISUKE
FUKUSHIMA MAKOTO
NABEYA OSAMU
FUKUSHIMA MAKOTO
NABEYA OSAMU
Application Number:
JP2018059670A
Publication Date:
October 10, 2019
Filing Date:
March 27, 2018
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/32; H01L21/304
Domestic Patent References:
| JP2017074639A | 2017-04-20 | |||
| JP2007266068A | 2007-10-11 | |||
| JP2008023603A | 2008-02-07 | |||
| JP2008302495A | 2008-12-18 |
Foreign References:
| WO2006038259A1 | 2006-04-13 | |||
| WO2006114854A1 | 2006-11-02 |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe