Title:
LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2019179777
Kind Code:
A
Abstract:
To provide an encapsulation body and an organic electroluminescent device having high air-tightness regardless of a pattern of a first metal layer overlapped with a glass frit.SOLUTION: A second metal layer is provided in a region where a common power supply line and a glass frit are overlapped with each other. Since the second metal layer absorbs and reflects laser light, the glass frit can be heated uniformly. Therefore, an encapsulated body can be encapsulated by low-melting point glass by which cracks are less likely to be generated.SELECTED DRAWING: Figure 1
Inventors:
NISHITO SUKENORI
Application Number:
JP2019139954A
Publication Date:
October 17, 2019
Filing Date:
July 30, 2019
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
H05B33/04; H01L51/50; H05B33/06; H05B44/00
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