Title:
DOUBLE SIDE POLISHING DEVICE FOR WORKPIECE
Document Type and Number:
Japanese Patent JP2019181632
Kind Code:
A
Abstract:
To provide a double side polishing device for workpiece capable of accurately measuring thickness of a workpiece for a long term relative to prior art, for polishing double sides of the workpiece.SOLUTION: A double side polishing device comprises on an upper mold platen 2 or lower mold platen, one or more open holes 10 penetrating from a top surface to a lower surface of an upper mold platen 2 or of a lower mold platen, a polishing pad 7 has a hole(s) 11 at a position corresponding to the open hole 10, and in double side polishing of the workpiece W, a workpiece thickness measurement tool measures thickness of the workpiece W. Each of one or more open holes 10 has a solid window material 13 inserted thereinto, the window material 13 is formed of a cylindrical part 14 and a flange part 15 having a diameter larger than a diameter of the open hole 10, a side face 14a of the cylindrical part 14 has an annular recess 14b, in a state of arranging an O-ring 16 on the annular recess 14b, the cylindrical part 14 is inserted from the polishing pad 7 side into the open hole 10.SELECTED DRAWING: Figure 3
Inventors:
KUBOTA MAMI
TAKANASHI KEIICHI
TAKANASHI KEIICHI
Application Number:
JP2018076296A
Publication Date:
October 24, 2019
Filing Date:
April 11, 2018
Export Citation:
Assignee:
SUMCO CORP
International Classes:
B24B37/013; B24B37/08; B24B49/12; H01L21/304
Domestic Patent References:
| JP2011249833A | 2011-12-08 | |||
| JP2017052027A | 2017-03-16 |
Foreign References:
| US20030180973A1 | 2003-09-25 | |||
| US20030205325A1 | 2003-11-06 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Keisuke Kawahara
Mitsutsugu Sugimura
Keisuke Kawahara